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RFN10TF6SFHC9 - ROHM Semiconductor

Description: Fast Recovery Diode (AEC-Q101 Qualified)

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RFN10TF6SFHC9 - ROHM Semiconductor - PCB symbol
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PCB Footprints
RFN10TF6SFHC9 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220NFM_2 pin
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3D Models
RFN10TF6SFHC9 - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - TO220NFM_2 pin
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RFN10TF6SFHC9 Details

  • Manufacturer Part Number:

    RFN10TF6SFHC9

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220NFM, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    SUPER FAST RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.55 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.05 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN10TF6SFHC9 Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's essential to follow the recommended land pattern and thermal via structure to ensure proper heat dissipation.
  • To ensure output voltage stability, it's crucial to use a high-quality output capacitor with low ESR (Equivalent Series Resistance) and a sufficient capacitance value. ROHM recommends a 10uF or larger ceramic capacitor with an ESR of 10mΩ or less.
  • The maximum ambient temperature for the RFN10TF6SFHC9 is 85°C. However, it's essential to consider the device's thermal resistance and the PCB's thermal design to ensure the junction temperature remains within the recommended range.
  • Yes, the RFN10TF6SFHC9 is AEC-Q100 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow ROHM's guidelines for usage in these applications and to consult with ROHM's support team for specific requirements.
  • The RFN10TF6SFHC9 has a built-in thermal shutdown feature that activates when the junction temperature exceeds 150°C. When this occurs, the device will shut down to prevent damage. To handle this feature, it's essential to implement a thermal monitoring and shutdown circuitry in your design.

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RFN10TF6SFHC9 Overview

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