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RFN1LAM7STR - ROHM Semiconductor

Description: Super Fast Recovery Diode

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Symbol
RFN1LAM7STR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RFN1LAM7STR - ROHM Semiconductor PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - PMDTM SOD-128
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3D Models
RFN1LAM7STR - ROHM Semiconductor - 3D model - Small Outline Diode Flat Lead - PMDTM SOD-128
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RFN1LAM7STR Details

  • Manufacturer Part Number:

    RFN1LAM7STR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Date Of Intro:

    2017-03-13

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.15

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    700 V

  • Reverse Recovery Time-Max:

    0.08 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN1LAM7STR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF signal traces short and away from noisy digital signals. Use a 50-ohm microstrip line for the RF output.
  • Ensure good airflow around the device, and consider using a heat sink if the device is expected to operate in high-temperature environments. Monitor the device's junction temperature (Tj) to prevent overheating.
  • The recommended input power level is -20 dBm to 10 dBm. Exceeding this range may cause compression or damage to the device.
  • Use a shielded enclosure, and ensure the PCB is properly grounded. Keep the RF signal traces short and away from noisy digital signals. Use EMI filters or shielding on the input and output lines if necessary.
  • The typical settling time is around 100 ns, but this can vary depending on the specific application and operating conditions. Consult the datasheet and application notes for more information.

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RFN1LAM7STR Overview

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