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RFN2L4SDDTE25 - ROHM Semiconductor

Description: Fast Recovery Diode (AEC-Q101 Qualified)

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PCB Footprints
RFN2L4SDDTE25 - ROHM Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - SOD-106
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3D Models
RFN2L4SDDTE25 - ROHM Semiconductor  - 3D model - Diodes Moulded - SOD-106
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RFN2L4SDDTE25 Details

  • Manufacturer Part Number:

    RFN2L4SDDTE25

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-106, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.55 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN2L4SDDTE25 Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane, and the use of vias to connect the signal traces to the ground plane. Additionally, keeping the signal traces short and using a 50Ω impedance matching network can help optimize performance.
  • The RFN2L4SDDTE25 requires a bias voltage of 2.5V to 5.5V. Ensure that the bias voltage is stable and within the recommended range. Also, use a low-ESR capacitor (e.g., 100nF) to decouple the bias voltage from the power supply.
  • The RFN2L4SDDTE25 can operate from -40°C to +125°C. However, the device's performance may degrade at higher temperatures, so it's essential to ensure proper heat dissipation and thermal management in the design.
  • The RFN2L4SDDTE25 has an internal ESD protection diode, but it's still recommended to use external ESD protection devices (e.g., TVS diodes) to protect the device from electrostatic discharge. Follow proper ESD handling procedures during assembly and testing.
  • Store the RFN2L4SDDTE25 in a dry, cool place (temperature range: 5°C to 30°C, humidity: 60% or less). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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RFN2L4SDDTE25 Overview

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