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RFN3BM2SFHTL - ROHM Semiconductor

Description: Super Fast Recovery Diode (AEC-Q101 Qualified)

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PCB Footprints
RFN3BM2SFHTL - ROHM Semiconductor PCB footprint - Other - Other - TO-252 (DPAK)_Master
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3D Models
RFN3BM2SFHTL - ROHM Semiconductor  - 3D model - Other - TO-252 (DPAK)_Master
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RFN3BM2SFHTL Details

  • Manufacturer Part Number:

    RFN3BM2SFHTL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-63, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.45

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.98 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    40 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.025 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFN3BM2SFHTL Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF signal traces short and away from noisy digital signals.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow and avoid blocking airflow around the device. Monitor the device temperature and adjust the system design accordingly.
  • The recommended input impedance is 50 ohms. Ensure the input impedance of the circuit is matched to the device's output impedance for maximum power transfer.
  • Use a shielded enclosure, keep the device away from noisy components, and use EMI filters or chokes to reduce radiation. Ensure good grounding and decoupling in the PCB design.
  • The maximum allowable voltage deviation is ±10% of the recommended operating voltage. Exceeding this deviation may affect device performance or reliability.

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RFN3BM2SFHTL Overview

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