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RFPA3809TR13 - Qorvo

Description: GaAs HBT 400MHz TO 2700MHz POWER AMPLIFIER

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RFPA3809TR13 - Qorvo PCB footprint - Small Outline Packages - Small Outline Packages - RFPA3809TR13
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RFPA3809TR13 - Qorvo  - 3D model - Small Outline Packages - RFPA3809TR13
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RFPA3809TR13 Details

  • Manufacturer Part Number:

    RFPA3809TR13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT PLASTIC, SOIC-8

  • Manufacturer:

    Qorvo

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Construction:

    COMPONENT

  • Gain:

    12.4 dB

  • Input Power-Max (CW):

    26 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Frequency-Max:

    2700 MHz

  • Operating Frequency-Min:

    400 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOP8,.25

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND MEDIUM POWER

  • Supply Current-Max:

    350 mA

  • Surface Mount:

    YES

  • Technology:

    GAAS

  • Terminal Finish:

    Matte Tin (Sn)

  • VSWR-Max:

    2

RFPA3809TR13 Frequently Asked Questions (FAQs)

  • Qorvo provides a recommended PCB layout and thermal management guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent overheating.
  • Qorvo provides a set of recommended input and output matching networks in their datasheet and application notes. However, the optimal matching network design may vary depending on the specific application and frequency band. Engineers can use simulation tools and iterative design processes to optimize the matching networks for their specific use case.
  • Qorvo provides guidelines for soldering and assembly in their datasheet and application notes. It's essential to follow these guidelines to prevent damage to the device and ensure reliable operation. In general, a controlled soldering process with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds is recommended.
  • To ensure the device operates within the specified thermal limits, engineers should follow Qorvo's recommended thermal management guidelines, including the use of thermal vias, thermal pads, and heat sinks. Additionally, they should monitor the device's temperature and adjust the thermal management design as needed to prevent overheating.
  • Operating the device outside of the recommended operating conditions can lead to reduced performance, reliability, and lifespan. Engineers should ensure that the device operates within the specified voltage, current, and temperature ranges to prevent damage and ensure reliable operation.

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RFPA3809TR13 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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