Please enter a minimum 3 letters or numbers
Technical Content
Part Image

RFS30TZ6SGC13 - ROHM Semiconductor

Description: 650V 30A, TO-247-2L, Ultra Soft Recovery Type, Ultra Fast Recovery Diode

Download RFS30TZ6SGC13 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
RFS30TZ6SGC13 - ROHM Semiconductor - PCB symbol
click to zoom
PCB Footprints
RFS30TZ6SGC13 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-2L, (TO-247GE-2L)
click to zoom
3D Models
RFS30TZ6SGC13 - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - TO-247-2L, (TO-247GE-2L)
click to zoom

RFS30TZ6SGC13 Details

  • Manufacturer Part Number:

    RFS30TZ6SGC13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-247GE-2L, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.3 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    160 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFS30TZ6SGC13 Frequently Asked Questions (FAQs)

  • ROHM recommends a land pattern with a minimum pad size of 0.8mm x 0.8mm and a solder mask opening of 0.5mm x 0.5mm to ensure reliable soldering and thermal performance.
  • To manage thermal performance, ensure good thermal conductivity between the device and the PCB by using thermal vias, thermal pads, and a heat sink if necessary. Also, follow ROHM's recommended thermal design guidelines.
  • The maximum operating temperature range for RFS30TZ6SGC13 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • While RFS30TZ6SGC13 is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments. If you must use it in such an environment, ensure proper sealing and conformal coating to prevent moisture ingress.
  • ROHM recommends a soldering temperature profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

RFS30TZ6SGC13 Overview

Use the download button to access the RFS30TZ6SGC13 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RFS30, or try a keyword search, such as Rectifier Diodes

Parts related to RFS30TZ6SGC13

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑