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RFS60TZ6SGC13 - ROHM Semiconductor

Description: Diodes - General Purpose, Power, Switching SUPER FAST RECOVER

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Symbol
RFS60TZ6SGC13 - ROHM Semiconductor - PCB symbol
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PCB Footprints
RFS60TZ6SGC13 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-2L, (TO-247GE-2L)
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3D Models
RFS60TZ6SGC13 - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - TO-247-2L, (TO-247GE-2L)
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RFS60TZ6SGC13 Details

  • Manufacturer Part Number:

    RFS60TZ6SGC13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-247GE, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    ULTRA FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.3 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Output Current-Max:

    60 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.055 µs

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFS60TZ6SGC13 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • ROHM recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Ensure the PCB is clean and dry, and use a solder paste with a melting point above 217°C (423°F).
  • The maximum allowed voltage for the RFS60TZ6SGC13 is 60V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Store the RFS60TZ6SGC13 in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device by the package body, not the leads.
  • The recommended operating temperature range for the RFS60TZ6SGC13 is -40°C to 150°C (-40°F to 302°F). Operating outside this range may affect the device's performance and reliability.

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RFS60TZ6SGC13 Overview

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