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RFSA2023TR7 - Qorvo

Description: • Broadband 50MHz to 6000 MHz • 30 dB Attenuation Range • +50 dBm Input IP3 • +80 dBm Input IP2 • >+30 dBm High 1 dB Compression • 1mA Low Current Consumption • 3.3V Power Supply • Linear in dB Control Characteristic • Internal Temperature Compensation • 5V Version Available - RFSA2013

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PCB Footprints
RFSA2023TR7 - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - 16-QFN_2023
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3D Models
RFSA2023TR7 - Qorvo  - 3D model - Quad Flat No-Lead - 16-QFN_2023
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RFSA2023TR7 Details

  • Manufacturer Part Number:

    RFSA2023TR7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • ECCN Code:

    5A991.G

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    7.2

  • Attenuation-Nom:

    33.2 dB

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    30 dBm

  • Insertion Loss-Max:

    3.5 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    16

  • Operating Frequency-Max:

    6000 MHz

  • Operating Frequency-Min:

    50 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Power Supplies:

    3.3 V

  • RF/Microwave Device Type:

    VARIABLE ATTENUATOR

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • VSWR-Max:

    1.43

RFSA2023TR7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate layer for the RF signal is recommended. Use a via-stitched ground plane and a 50-ohm microstrip line for the RF signal. Ensure proper decoupling and grounding of the device.
  • Use a combination of load-pull and source-pull simulations to optimize the output and input matching networks. Adjust the bias voltage and current to achieve the optimal quiescent point for maximum gain and efficiency.
  • Ensure good thermal conductivity between the device and the heat sink. Use a thermal interface material with a thermal conductivity of at least 1 W/m-K. Maintain a maximum junction temperature of 150°C to ensure reliability.
  • Use a shielded enclosure and ensure proper grounding of the device. Implement EMI filters and shielding on the PCB. Follow good EMC design practices, such as keeping sensitive circuits away from the RF path.
  • Qorvo performs various reliability tests, including temperature cycling, humidity testing, and electrical overstress testing. The device is also qualified according to AEC-Q102 and GR-468 standards.

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RFSA2023TR7 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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