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RFV12TJ6SGC9 - ROHM Semiconductor

Description: Super Fast Recovery Diode

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PCB Footprints
RFV12TJ6SGC9 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220ACFP
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3D Models
RFV12TJ6SGC9 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-220ACFP
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RFV12TJ6SGC9 Details

  • Manufacturer Part Number:

    RFV12TJ6SGC9

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TO-220ACFP, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Application:

    SUPER HYPER FAST RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    2.8 V

  • JEDEC-95 Code:

    TO-220AC

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    12 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.045 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

RFV12TJ6SGC9 Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces as short as possible. Additionally, it's recommended to use a common mode choke and a pi-filter to reduce EMI.
  • Ensure good thermal design and heat dissipation by providing a sufficient heat sink, and keeping the device away from heat sources. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage deviation is ±10% of the nominal input voltage. Exceeding this limit may affect the device's performance, reliability, or even cause damage.
  • While the RFV12TJ6SGC9 is not specifically designed for high-humidity environments, it can operate in humid conditions. However, it's essential to follow proper PCB design and assembly guidelines to prevent moisture-related issues.
  • Start by verifying the input voltage, output voltage, and current consumption. Check for any signs of overheating, and ensure the device is properly soldered and connected. If issues persist, consult ROHM's application notes and technical support resources.

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RFV12TJ6SGC9 Overview

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