RG2012N-202-W-T1 footprint, schematic symbol and 3D model by Susumu

Symbol

PCB Footprints

3D Models

RG2012N-202-W-T1 Details

The recommended land pattern for the RG2012N-202-W-T1 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solderable finish.
The RG2012N-202-W-T1 has a thermal resistance of 35°C/W. To ensure reliable operation, it's recommended to provide a thermal pad or heat sink to dissipate heat. A minimum of 1mm² of copper area is recommended for thermal dissipation.
The RG2012N-202-W-T1 has an operating temperature range of -55°C to +125°C. However, it's recommended to derate the component's power rating above 85°C to ensure reliable operation.
Yes, the RG2012N-202-W-T1 is suitable for high-frequency applications up to 1 GHz. However, it's recommended to evaluate the component's performance in your specific application and consider factors such as parasitic inductance and capacitance.
The RG2012N-202-W-T1 should be stored in a dry, cool place away from direct sunlight. It's recommended to handle the component by the body, avoiding touching the leads or electrical contacts. Anti-static precautions should be taken when handling the component.

Community Provided

System Verified

Community Approved

Use the download button to access the RG2012N-202-W-T1 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like RG201, or try a keyword search, such as Fixed Resistors

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →