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RG2012N-680-D-T5 - Susumu

Description: RG2012N-680-D-T5

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Symbol
RG2012N-680-D-T5 - Susumu - PCB symbol
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PCB Footprints
RG2012N-680-D-T5 - Susumu PCB footprint - Resistor Chip - Resistor Chip - 2012
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3D Models
RG2012N-680-D-T5 - Susumu - 3D model - Resistor Chip - 2012
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RG2012N-680-D-T5 Details

  • Manufacturer Part Number:

    RG2012N-680-D-T5

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Susumu Co Ltd

  • YTEOL:

    11

  • Additional Feature:

    ANTI-SULFUR, HIGH PRECISION

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.4 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    68 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    150 V

RG2012N-680-D-T5 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RG2012N-680-D-T5 is a rectangular pad with a size of 1.2mm x 0.6mm, with a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal stress.
  • Yes, the RG2012N-680-D-T5 is designed for high-frequency applications up to 1 GHz, with a low inductance of 0.5 nH and a high self-resonant frequency of 2.5 GHz, making it suitable for RF and microwave circuits.
  • The thermal resistance of the RG2012N-680-D-T5 is 250°C/W, which means it can dissipate 0.25 W of power per degree Celsius of temperature rise above the ambient temperature.
  • Yes, the RG2012N-680-D-T5 is compatible with lead-free soldering, with a melting point of 260°C, which is higher than the typical lead-free soldering temperature of 220°C.
  • The MSL of the RG2012N-680-D-T5 is 1, which means it can withstand a maximum of 30 days of exposure to a humidity level of 60% at 30°C without requiring any special handling or storage.

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RG2012N-680-D-T5 Overview

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