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RGF1J - onsemi

Description: Glass passivated junction. ; For surface mounted application. ; Easy pick and place. ; High current capability. ; Low forward voltage drop. ; High surge current capability.; These Devices are Pb−Free and are RoHS Compliant; NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable

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PCB Footprints
RGF1J - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC_1
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3D Models
RGF1J - onsemi  - 3D model - Diodes Moulded - DO-214AC_1
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RGF1J Details

  • Manufacturer Part Number:

    RGF1J

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.76 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.25 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RGF1J Frequently Asked Questions (FAQs)

  • A good PCB layout for the RGF1J involves keeping the input and output traces separate, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • To ensure proper biasing, make sure to follow the recommended biasing circuit in the datasheet, which includes a voltage divider network to set the output voltage. Also, ensure that the input voltage is within the recommended range and that the device is operated within the specified temperature range.
  • The maximum allowable power dissipation for the RGF1J is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.5W at 25°C ambient temperature. However, this value can be derated at higher temperatures.
  • Yes, the RGF1J can be used in a switching regulator application. However, it's essential to ensure that the device is operated within the recommended frequency range and that the output voltage is properly filtered to minimize ripple and noise.
  • To protect the RGF1J from overvoltage and overcurrent conditions, it's recommended to use a voltage clamp or a zener diode to limit the input voltage, and a current-limiting resistor or a fuse to prevent excessive current. Additionally, consider using a thermal shutdown circuit to prevent overheating.

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RGF1J Overview

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