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RGP10J - onsemi

Description: Glass passivated cavity-free junction. ; Fast switching for high efficiency.; Typical IR less than 1µA. ; 1.0 ampere operation at TA = 55°C with no thermal runaway. ; High temperature metallurgically bonded construction.

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PCB Footprints
RGP10J - onsemi PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-41
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3D Models
RGP10J - onsemi  - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-41
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RGP10J Details

  • Manufacturer Part Number:

    RGP10J

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    Axial Lead / DO-41

  • Package Description:

    D4, 2 PIN

  • Manufacturer Package Code:

    017AH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.92

  • Additional Feature:

    METALLURGICALLY BONDED

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-41

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    3 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.25 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RGP10J Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the RGP10J is a pad size of 1.3 mm x 0.8 mm with a 0.5 mm spacing between pads. A thermal pad of 2.5 mm x 2.5 mm is also recommended for heat dissipation.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads and place the RGP10J on top. Use a reflow oven or a hot air gun to melt the solder paste, and ensure the component is properly aligned during the soldering process.
  • The RGP10J has an operating temperature range of -40°C to 150°C. However, the maximum junction temperature (TJ) should not exceed 150°C to ensure reliable operation and prevent thermal damage.
  • The RGP10J is a sensitive electronic component and requires proper handling during storage and shipping. Store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive pressure to the component leads.
  • The RGP10J is an electrostatic discharge (ESD) sensitive device. Handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Avoid touching the component leads or body, and ensure the workspace is ESD-safe.

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RGP10J Overview

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For a full list of alternate parts for RGP10J, check out Findchips.com