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RGP30B-E3/73 - Vishay

Description: Diodes - General Purpose, Power, Switching 100 Volt 3.0A 150ns 125 Amp IFSM

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Symbol
RGP30B-E3/73 - Vishay - PCB symbol
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PCB Footprints
RGP30B-E3/73 - Vishay PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - RGP30B-E3/73*
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3D Models
RGP30B-E3/73 - Vishay - 3D model - Diodes, Axial Diameter Horizontal Mounting - RGP30B-E3/73*
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RGP30B-E3/73 Details

  • Manufacturer Part Number:

    RGP30B-E3/73

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    125 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Recovery Time-Max:

    0.15 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

RGP30B-E3/73 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the RGP30B-E3/73 is a rectangular pad with dimensions of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner and a 0.3 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder flux to the pads. Also, make sure the PCB is clean and free of oxidation.
  • The maximum power dissipation of the RGP30B-E3/73 is 30 W, but it's recommended to derate the power dissipation based on the ambient temperature and thermal resistance of the PCB.
  • Yes, the RGP30B-E3/73 is suitable for high-frequency applications up to 1 GHz, but it's essential to consider the parasitic inductance and capacitance of the resistor in your design.
  • Yes, the RGP30B-E3/73 is compatible with lead-free soldering processes, but it's recommended to follow the manufacturer's guidelines for lead-free soldering to ensure reliability.

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RGP30B-E3/73 Overview

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