RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and heat dissipation around the module is crucial to prevent overheating.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range, to filter the input voltage and reduce ripple.
Yes, the RH-1515D/H6 can be used in a redundant configuration to achieve high reliability. However, it is essential to ensure that the modules are properly synchronized and that the output voltages are matched to prevent current imbalances and reduce the risk of failure.
The typical MTBF for the RH-1515D/H6 is >1 million hours, calculated according to MIL-HDBK-217F, Notice 2. However, the actual MTBF may vary depending on the application, operating conditions, and environmental factors.
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RH-1515D/H6 Overview
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