RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, RECOM recommends following the derating curves provided in the datasheet, using a suitable heat sink, and ensuring good airflow around the module. Additionally, the module should be operated within the specified temperature range and not be subjected to thermal shocks.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, rated for the input voltage, as close to the module's input pins as possible. This helps to filter out input noise and ensure stable operation.
Yes, the RKZ-1205S can be used in a redundant or parallel configuration, but RECOM recommends consulting with their application engineers to ensure proper design and implementation. Additionally, the modules should be synchronized to prevent oscillations and ensure stable operation.
The typical MTBF for the RKZ-1205S is >1 million hours, calculated according to MIL-HDBK-217F, at 40°C ambient temperature and 50% load. However, this value may vary depending on the specific application and operating conditions.
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RKZ-1205S Overview
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