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RL107-AP - MCC

Description: Standard Recovery Rectifiers

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PCB Footprints
RL107-AP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - A-405-1
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3D Models
RL107-AP - MCC  - 3D model - Diodes, Axial Diameter Horizontal Mounting - A-405-1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for RL107-AP
  • Part Number RL107-AP
  • Manufacturer MCC
  • Pin Count 2
  • Part Category Bridge Rectifier
  • Package Category Diodes, Axial Diameter Horizontal Mounting
  • Footprint Name Diodes, Axial Diameter Horizontal Mounting - A-405-1
  • Released Date Feb 12, 2024
  • Last Modified Date May 17, 2024 4:34 PM UTC
  • Pinout / Pin List Click Here (Member Only)

RL107-AP Details

  • Manufacturer Part Number:

    RL107-AP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • Application:

    GENERAL PURPOSE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

RL107-AP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RL107-AP is a rectangular pad with a size of 1.5mm x 0.8mm, with a 0.3mm x 0.3mm thermal pad in the center. The pad should be solder-mask defined and have a non-solder-mask-defined (NSMD) pad for the thermal pad.
  • The thermal pad should be connected to a solid copper plane on the PCB to ensure good heat dissipation. During assembly, apply a small amount of thermal interface material (TIM) to the thermal pad before mounting the component. Ensure the TIM is evenly spread and not excessive, as it can affect the component's performance.
  • The RL107-AP can operate safely within a temperature range of -40°C to 125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • The RL107-AP is designed to withstand moderate vibration levels. However, if the application involves extreme vibration, it's recommended to use additional mechanical support or consider a more ruggedized component. Consult with the manufacturer or a qualified engineer for specific guidance.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the pads, and use a gentle touch to avoid damaging the component. Inspect the solder joints for proper wetting, and rework any defective joints promptly.

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RL107-AP Overview

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