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RL1206FR-070R062L - Yageo Group

Description: Current Sense Resistors - SMD 62 mOhms 250mWat 1 % 1000 ppm/C

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RL1206FR-070R062L - Yageo Group - PCB symbol
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PCB Footprints
RL1206FR-070R062L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RL1206
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RL1206FR-070R062L - Yageo Group - 3D model - Resistor Chip - RL1206
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RL1206FR-070R062L Details

  • Manufacturer Part Number:

    RL1206FR-070R062L

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.062 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    1000 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1245 V

RL1206FR-070R062L Frequently Asked Questions (FAQs)

  • The recommended land pattern for RL1206FR-070R062L is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RL1206FR-070R062L is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • Yes, RL1206FR-070R062L is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's crucial to follow the recommended soldering profile to prevent damage to the component.
  • The MSL of RL1206FR-070R062L is MSL 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering.
  • Yes, RL1206FR-070R062L is designed to withstand high-vibration and high-shock environments. However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the expected vibration and shock levels.

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RL1206FR-070R062L Overview

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