The recommended land pattern for RL1632R-R050-F is a rectangular pad with a size of 1.6mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
Yes, RL1632R-R050-F is compatible with lead-free soldering. Susumu Co Ltd uses a lead-free soldering process that meets the requirements of the RoHS directive.
The MSL of RL1632R-R050-F is MSL 1, which means it can withstand a maximum of 30 days of exposure to ambient humidity and temperature conditions before soldering.
Yes, RL1632R-R050-F is suitable for high-frequency applications up to 1 GHz due to its low inductance and high-frequency characteristics. However, it's essential to consider the parasitic inductance and capacitance of the component and the PCB layout when designing high-frequency circuits.
Yes, RL1632R-R050-F is AEC-Q200 qualified, which means it meets the stringent requirements for automotive applications, including high-temperature operation, humidity, and vibration testing.
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RL1632R-R050-F Overview
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