RLS-567-R - RECOM Power

RLS-567-R Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use the RLS-567-R in a high-vibration environment?
  Yes, the RLS-567-R is designed to withstand vibrations up to 10G peak acceleration, making it suitable for use in high-vibration environments. However, it's essential to ensure proper mounting and screw torque to prevent damage.
• How do I ensure the module's reliability in high-temperature applications?
  To ensure reliability in high-temperature applications, RECOM recommends derating the output power by 2.5% per degree Celsius above 40°C. Additionally, ensure good airflow and a clean, dry environment to prevent moisture ingress.
• What is the recommended input capacitor value and type for the RLS-567-R?
  RECOM recommends using a low-ESR, high-frequency ceramic capacitor with a value of 10-22 μF, 50V or higher, placed as close as possible to the input pins of the module.
• Can I use the RLS-567-R in a redundant or parallel configuration?
  Yes, the RLS-567-R can be used in a redundant or parallel configuration, but it's essential to ensure proper synchronization and current sharing between modules. RECOM recommends consulting their application notes and seeking guidance from their technical support team.