RM-1205S/H - RECOM Power

RM-1205S/H Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensuring good airflow and heat dissipation around the module can help to reduce the operating temperature.
• What is the recommended input capacitor type and value for this module?
  RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage range, as close as possible to the module's input pins. This helps to filter out input noise and ensure stable operation.
• Can I use this module in a redundant or parallel configuration?
  Yes, the RM-1205S/H can be used in a redundant or parallel configuration, but RECOM recommends consulting with their application engineers to ensure proper design and implementation. Additionally, the modules should be synchronized to prevent oscillations and ensure stable operation.
• What is the module's behavior during input voltage brownout or dropout?
  The RM-1205S/H has a built-in undervoltage lockout (UVLO) circuit that shuts down the module when the input voltage falls below a certain threshold (typically around 10V). The module will automatically restart when the input voltage recovers.