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RMCF0402FT634K - Stackpole Electronics, Inc.

Description: RES, 0402, 634 Kohm, 1%, 0.0625W

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RMCF0402FT634K - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0402FT634K - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - 0402.-1
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3D Models
RMCF0402FT634K - Stackpole Electronics, Inc. - 3D model - Resistor Chip - 0402.-1
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RMCF0402FT634K Details

  • Manufacturer Part Number:

    RMCF0402FT634K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    634000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

RMCF0402FT634K Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0402FT634K is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, RMCF0402FT634K is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's power rating should be derated according to the temperature derating curve provided in the datasheet.
  • RMCF0402FT634K is a moisture-sensitive device (MSD) and should be stored in a dry environment with a relative humidity of less than 30%. If the component is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before reflow soldering.
  • The recommended reflow soldering profile for RMCF0402FT634K is a peak temperature of 260°C, with a dwell time above 220°C of 30-60 seconds. The ramp rate should be 3°C/second or less, and the cooling rate should be 6°C/second or less.
  • Yes, RMCF0402FT634K is designed to withstand high-vibration environments. The component's terminals are designed to be flexible and can absorb vibrations up to 10G. However, the component's performance should be validated through vibration testing according to the application's specific requirements.

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RMCF0402FT634K Overview

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RMCF0402FT634K Alternates

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Part Image RMCF0402FG634K SEI Stackpole Electronics Inc

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Part Image RMEP0402FT634K SEI Stackpole Electronics Inc

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Part Image ASAS10-6343-FN ASJ Holdings Limited

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For a full list of alternate parts for RMCF0402FT634K, check out Findchips.com