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RMCF0402FT8K06 - Stackpole Electronics, Inc.

Description: RES, 0402, 8.06 Kohm, 1%, 0.0625W

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RMCF0402FT8K06 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0402FT8K06 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0402
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RMCF0402FT8K06 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0402
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RMCF0402FT8K06 Details

  • Manufacturer Part Number:

    RMCF0402FT8K06

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    8060 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    50 V

RMCF0402FT8K06 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF0402FT8K06 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape.
  • The RMCF0402FT8K06 is a moisture-sensitive device and should be stored in a dry environment. If the component is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before reflow soldering.
  • The maximum reflow temperature for the RMCF0402FT8K06 is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds.
  • Yes, the RMCF0402FT8K06 is suitable for high-frequency applications up to 1 GHz. However, the component's performance may degrade at higher frequencies due to parasitic inductance and capacitance.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a reflow oven with a nitrogen atmosphere to minimize oxidation.

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RMCF0402FT8K06 Overview

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Part Image BCTS000402-8061FTH Chilisin Electronics Corp

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For a full list of alternate parts for RMCF0402FT8K06, check out Findchips.com