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RMCF0603FG732K - Stackpole Electronics, Inc.

Description: RES, 0603, 732K ohm, 1%, 0.1W

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RMCF0603FG732K - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0603FG732K - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0603
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RMCF0603FG732K - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0603
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RMCF0603FG732K Details

  • Manufacturer Part Number:

    RMCF0603FG732K

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    13

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 10 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    732000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

RMCF0603FG732K Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0603FG732K is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, RMCF0603FG732K is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the parasitic inductance and capacitance of the component and the PCB layout to ensure optimal performance.
  • The maximum operating temperature for RMCF0603FG732K is 125°C. However, the component's performance and reliability may degrade at temperatures above 85°C. It's recommended to derate the component's power rating at higher temperatures.
  • Yes, RMCF0603FG732K is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's essential to follow the recommended soldering profile and temperature to ensure reliable assembly.
  • The moisture sensitivity level (MSL) of RMCF0603FG732K is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity without requiring baking before reflow soldering.

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RMCF0603FG732K Overview

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