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RMCF0603FT1M69 - Stackpole Electronics, Inc.

Description: RES, 0603, 1.69 Mohm, 1%, 0.1W

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RMCF0603FT1M69 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0603FT1M69 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0603
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3D Models
RMCF0603FT1M69 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0603
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RMCF0603FT1M69 Details

  • Manufacturer Part Number:

    RMCF0603FT1M69

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.55 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1690000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

RMCF0603FT1M69 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0603FT1M69 is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, RMCF0603FT1M69 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's power rating should be derated according to the temperature derating curve provided in the datasheet.
  • RMCF0603FT1M69 is a moisture-sensitive device (MSD) and should be stored in a dry environment with a relative humidity of less than 30%. If the component is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before reflow soldering.
  • The recommended reflow soldering profile for RMCF0603FT1M69 is a peak temperature of 260°C, with a dwell time above 220°C of 30-60 seconds. The ramp rate should be 3°C/second or less, and the cooling rate should be 6°C/second or less.
  • Yes, RMCF0603FT1M69 is designed to withstand high-vibration environments. The component's terminals are designed to be flexible and can absorb vibrations up to 10G. However, the component's performance should be validated through vibration testing according to the specific application requirements.

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RMCF0603FT1M69 Overview

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RMCF0603FT1M69 Alternates

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Part Image CR-03FAD--1M69 Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1.69e+06ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0603, CHIP
Part Image HFWF03FT-1694 Hitano Enterprise Corp

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1.69e+06ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0603
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Part Image FWF03FW-1694 Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1690000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0603
Part Image WR06W1694FGLV Walsin Technology Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1.69e+06ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for RMCF0603FT1M69, check out Findchips.com