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RMCF0805FT1K02 - Stackpole Electronics, Inc.

Description: Thick Film Resistors - SMD RES, 0805, 1.02 Kohm, 1%, 0.125W

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RMCF0805FT1K02 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF0805FT1K02 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0805
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RMCF0805FT1K02 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0805
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RMCF0805FT1K02 Details

  • Manufacturer Part Number:

    RMCF0805FT1K02

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1020 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RMCF0805FT1K02 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0805FT1K02 is a rectangular pad with a size of 1.2mm x 1.4mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RMCF0805FT1K02 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and to follow the recommended storage and handling procedures.
  • During PCB assembly, it's essential to handle RMCF0805FT1K02 with care to prevent damage. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD). Avoid touching the component's leads or body, and use a vacuum pickup or tweezers to handle the component.
  • The MSL of RMCF0805FT1K02 is MSL 1, which means it can withstand a maximum of 30 days of exposure to ambient humidity and temperature conditions before it needs to be baked or reflowed.
  • RMCF0805FT1K02 is not designed for use in humid or corrosive environments. It's essential to ensure that the component is used in a controlled environment with minimal exposure to moisture and corrosive substances to prevent degradation or failure.

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RMCF0805FT1K02 Overview

Use the download button to access the RMCF0805FT1K02 schematic symbol, PCB footprint, and 3D model.
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Part Image MC0805W-1021-FB RCD Components Inc

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