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RMCF0805FT249R - Stackpole Electronics, Inc.

Description: RES, 0805, 249 ohm, 1%, 0.125W

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RMCF0805FT249R - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0805
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RMCF0805FT249R - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - RMCF0805
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RMCF0805FT249R Details

  • Manufacturer Part Number:

    RMCF0805FT249R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    249 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RMCF0805FT249R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF0805FT249R is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • The RMCF0805FT249R is a moisture-sensitive device and should be stored in a dry environment. If the component is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before reflow soldering.
  • The maximum reflow temperature for the RMCF0805FT249R is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds.
  • Yes, the RMCF0805FT249R is suitable for high-frequency applications up to 1 GHz. However, the component's self-resonant frequency should be considered in the design.
  • To ensure proper soldering, the RMCF0805FT249R should be placed on a solder paste layer with a thickness of 0.1mm to 0.2mm. The component should be reflowed at a temperature of 220°C to 240°C for 30 seconds to 60 seconds.

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RMCF0805FT249R Overview

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Part Image ASAS21-2490-FY ASJ Holdings Limited

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 249ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP

Part Image CR-05FLD--249RAC Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 249ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image CR0805-8W-2490FT VENKEL LTD

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 249ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image RGC0805FTD249R SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 249ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image 9C08052A2490FKAFT YAGEO Corporation

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 249ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

For a full list of alternate parts for RMCF0805FT249R, check out Findchips.com