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RMCF0805JG1K00 - Stackpole Electronics, Inc.

Description: RES, 0805, 1 Kohm, 5%, 0.125W

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RMCF0805JG1K00 - Stackpole Electronics, Inc. - PCB symbol
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RMCF0805JG1K00 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0805
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RMCF0805JG1K00 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0805
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RMCF0805JG1K00 Details

  • Manufacturer Part Number:

    RMCF0805JG1K00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 10 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    150 V

RMCF0805JG1K00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0805JG1K00 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RMCF0805JG1K00 is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the self-resonant frequency (SRF) of the component, which is around 2.5 GHz, and ensure that the operating frequency is below the SRF to avoid resonance and potential performance issues.
  • RMCF0805JG1K00 is rated for operation up to 150°C, but its performance may degrade at higher temperatures. The component's impedance and Q factor may change, affecting its overall performance. It's essential to consider the operating temperature and potential derating when designing with this component.
  • Yes, RMCF0805JG1K00 is compatible with lead-free soldering processes, including RoHS and WEEE compliant processes. The component's termination is made of a lead-free material, and it can withstand the higher temperatures associated with lead-free soldering.
  • The typical tolerance for the inductance value of RMCF0805JG1K00 is ±5%. This means that the actual inductance value may vary by up to 5% from the nominal value of 1 μH.

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RMCF0805JG1K00 Overview

Use the download button to access the RMCF0805JG1K00 schematic symbol, PCB footprint, and 3D model.
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