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RMCF0805JT1M50 - Stackpole Electronics, Inc.

Description: RES, 0805, 1.5 Mohm, 5%, 0.125W

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RMCF0805JT1M50 - Stackpole Electronics, Inc. - PCB symbol
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RMCF0805JT1M50 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF0805
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RMCF0805JT1M50 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF0805
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RMCF0805JT1M50 Details

  • Manufacturer Part Number:

    RMCF0805JT1M50

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1500000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    150 V

RMCF0805JT1M50 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF0805JT1M50 is a rectangular pad with a size of 1.1mm x 1.4mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • RMCF0805JT1M50 is rated for operation up to 150°C, but it's recommended to derate the power rating by 1.5% per degree Celsius above 125°C. It's also important to ensure that the component is properly cooled to prevent thermal runaway.
  • Handle the RMCF0805JT1M50 by the edges to prevent damage to the terminations. Avoid touching the component's surface, as the oils from human skin can cause soldering issues. Use anti-static wrist straps and mats to prevent electrostatic discharge (ESD) damage.
  • The recommended soldering profile for RMCF0805JT1M50 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be completed within 3 minutes to prevent thermal damage.
  • RMCF0805JT1M50 is not designed for use in humid or corrosive environments. If exposure to moisture or corrosive substances is unavoidable, consider using a conformal coating or potting compound to protect the component.

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RMCF0805JT1M50 Overview

Use the download button to access the RMCF0805JT1M50 schematic symbol, PCB footprint, and 3D model.
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RMCF0805JT1M50 Alternates

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Part Image CRCW08051M50JNTA Vishay Intertechnologies

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1.5e+06ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805
Part Image RCA08051504JNEC Vishay Intertechnologies

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Part Image WR08X155_JBLZ Walsin Technology Corporation

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Part Image RMS10JT155 TA-I Technology Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1500000ohm, 150V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 0805
Part Image NMCR0805JT1M50 SEI Stackpole Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 1500000ohm, 150V, 5% +/-Tol, 200ppm/Cel, 0805
For a full list of alternate parts for RMCF0805JT1M50, check out Findchips.com