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RMCF1206FT232R - Stackpole Electronics, Inc.

Description: RES, 1206, 232 ohm, 1%, 0.25W

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RMCF1206FT232R - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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RMCF1206FT232R - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - RMCF1206
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RMCF1206FT232R Details

  • Manufacturer Part Number:

    RMCF1206FT232R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    232 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1206FT232R Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206FT232R is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for RMCF1206FT232R, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal impedance is ≤10°C/W.
  • The moisture sensitivity level (MSL) of RMCF1206FT232R is MSL 3, which means it can withstand a maximum of 168 hours of exposure to 30°C/60% RH before soldering.
  • Yes, RMCF1206FT232R is suitable for high-frequency applications up to 1 GHz. However, it's essential to follow proper PCB design and layout guidelines to minimize parasitic inductance and ensure optimal performance.
  • RMCF1206FT232R should be stored in a dry, cool place with a temperature range of 10°C to 30°C and humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.

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RMCF1206FT232R Overview

Use the download button to access the RMCF1206FT232R schematic symbol, PCB footprint, and 3D model.
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Part Image CR-06FL7--232R- SRT Resistor Technology Gmbh

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 232ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Part Image HPWR06FVEO2320A Hitano Enterprise Corp

Fixed Resistor, Metal Glaze/thick Film, 0.3333W, 232ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206

Part Image RC3216F2320CS Samsung Electro-Mechanics

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 232ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206

Part Image CAR12F2320CT Cal-Chip Electronics

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 232ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Part Image MCR18EZHF2320 ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 232ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206

For a full list of alternate parts for RMCF1206FT232R, check out Findchips.com