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RMCF1206JG1K00 - Stackpole Electronics, Inc.

Description: RES, 1206, 1 Kohm, 5%, 0.25W

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RMCF1206JG1K00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF1206JG1K00 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206-1
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3D Models
RMCF1206JG1K00 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1206-1
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RMCF1206JG1K00 Details

  • Manufacturer Part Number:

    RMCF1206JG1K00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 10 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

RMCF1206JG1K00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206JG1K00 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • Yes, RMCF1206JG1K00 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • To prevent damage during PCB assembly, handle the RMCF1206JG1K00 by the edges, avoid touching the component's surface, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD).
  • The MSL of RMCF1206JG1K00 is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity without requiring baking or other special handling.
  • Yes, RMCF1206JG1K00 is designed to withstand vibrations up to 10G, making it suitable for applications with moderate vibration levels. However, it's essential to ensure that the component is properly secured to the PCB to prevent mechanical stress.

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RMCF1206JG1K00 Overview

Use the download button to access the RMCF1206JG1K00 schematic symbol, PCB footprint, and 3D model.
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