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RMCF1206JT8K20 - Stackpole Electronics, Inc.

Description: RES, 1206, 8.2 Kohm, 5%, 0.25W

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PCB Footprints
RMCF1206JT8K20 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1206
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3D Models
RMCF1206JT8K20 - Stackpole Electronics, Inc.  - 3D model - Resistor Chip - RMCF1206
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RMCF1206JT8K20 Details

  • Manufacturer Part Number:

    RMCF1206JT8K20

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    8200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

RMCF1206JT8K20 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1206JT8K20 is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • Yes, RMCF1206JT8K20 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • Handle the RMCF1206JT8K20 by the edges or the body, avoiding touching the terminations or the component's surface. This prevents damage to the component and ensures reliable operation. Use ESD-safe handling and storage procedures to prevent electrostatic discharge damage.
  • The MSL of RMCF1206JT8K20 is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity. Proper storage and handling procedures should be followed to prevent moisture-related damage.
  • Yes, RMCF1206JT8K20 is designed to withstand vibrations up to 10G. However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the expected vibration levels.

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RMCF1206JT8K20 Overview

Use the download button to access the RMCF1206JT8K20 schematic symbol, PCB footprint, and 3D model.
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Part Image RC1206JRG078K2L YAGEO Corporation

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Part Image SR1-1206-282 NTE Electronics Inc

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Part Image SG73S2BLTD822J KOA Speer Electronics Inc

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For a full list of alternate parts for RMCF1206JT8K20, check out Findchips.com