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RMCF1210FT1R15 - Stackpole Electronics, Inc.

Description: RES, 1210, 1.15 ohm, 1%, 0.5W

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RMCF1210FT1R15 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF1210FT1R15 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1210
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RMCF1210FT1R15 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1210
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RMCF1210FT1R15 Details

  • Manufacturer Part Number:

    RMCF1210FT1R15

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    11

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1.15 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    400 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF1210FT1R15 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF1210FT1R15 is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and thermal management.
  • Yes, RMCF1210FT1R15 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency (SRF). However, it's essential to consider the component's parasitic inductance and capacitance in your design.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) between the component and the heat sink. The maximum operating temperature of RMCF1210FT1R15 is 150°C.
  • Yes, RMCF1210FT1R15 is compatible with lead-free soldering processes, including RoHS and WEEE compliance. The component's termination is made of a lead-free, tin-silver-copper alloy.
  • It's recommended to store RMCF1210FT1R15 in a dry, cool place with a temperature range of 10°C to 30°C and relative humidity below 60%. Avoid exposing the components to direct sunlight, moisture, or extreme temperatures.

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RMCF1210FT1R15 Overview

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Part Image TFA1210W1R15F-T5 Thin Film Technology Corp (TFT)

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