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RMCF1210JT150R - Stackpole Electronics, Inc.

Description: RES, 1210, 150 ohm, 5%, 0.5W

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RMCF1210JT150R - Stackpole Electronics, Inc. - PCB symbol
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RMCF1210JT150R - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF1210
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RMCF1210JT150R - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF1210
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RMCF1210JT150R Details

  • Manufacturer Part Number:

    RMCF1210JT150R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    150 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

RMCF1210JT150R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF1210JT150R is a rectangular pad with a size of 1.3mm x 2.5mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a thermal interface material (TIM) between the component and the heat sink. Also, ensure good airflow around the component.
  • The maximum operating temperature range for the RMCF1210JT150R is -55°C to 150°C, with a storage temperature range of -55°C to 180°C.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a solder flux to the component pads. Use a solder with a melting point of 217°C to 220°C, and avoid applying excessive heat or soldering for too long.
  • The recommended power derating for the RMCF1210JT150R is to reduce the power rating by 1.33% for every 1°C above 25°C, up to a maximum operating temperature of 150°C.

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RMCF1210JT150R Overview

Use the download button to access the RMCF1210JT150R schematic symbol, PCB footprint, and 3D model.
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