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RMCF1210JT300R - Stackpole Electronics, Inc.

Description: RES, 1210, 300 ohm, 5%, 0.5W

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RMCF1210JT300R - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF1210JT300R - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - 1210
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3D Models
RMCF1210JT300R - Stackpole Electronics, Inc. - 3D model - Resistor Chip - 1210
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RMCF1210JT300R Details

  • Manufacturer Part Number:

    RMCF1210JT300R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

RMCF1210JT300R Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF1210JT300R is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the RMCF1210JT300R should be placed on a flat, even surface to prevent warping or damage. The component should be aligned with the PCB pads and secured with a gentle pressure to ensure proper solder flow. The recommended reflow profile is 260°C peak temperature, with a 3-5 minute dwell time above 220°C.
  • The RMCF1210JT300R has an operating temperature range of -55°C to +125°C, with a derated power rating above 80°C. It's essential to ensure that the component does not exceed the maximum operating temperature to prevent damage or degradation.
  • The RMCF1210JT300R is designed to withstand moderate vibration levels, but it's not recommended for use in high-vibration environments. If vibration is a concern, it's essential to consult with the manufacturer or a qualified engineer to determine the suitability of the component for the specific application.
  • The RMCF1210JT300R should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be stored in its original packaging or a similar moisture-resistant package to prevent moisture absorption. It's essential to follow the manufacturer's storage guidelines to prevent damage or degradation.

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RMCF1210JT300R Overview

Use the download button to access the RMCF1210JT300R schematic symbol, PCB footprint, and 3D model.
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RMCF1210JT300R Alternates

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Part Image RAT12301JTP Ralec

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Part Image CQ07U2K0301TCE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 300ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1210
For a full list of alternate parts for RMCF1210JT300R, check out Findchips.com