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RMCF2512ZT0R00 - Stackpole Electronics, Inc.

Description: RES, 2512, Jumper

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RMCF2512ZT0R00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF2512ZT0R00 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF2512
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3D Models
RMCF2512ZT0R00 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF2512
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RMCF2512ZT0R00 Details

  • Manufacturer Part Number:

    RMCF2512ZT0R00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    9

  • Additional Feature:

    RATED CURRENT: 3A

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.3 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Plastic, 7 Inch

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistor Type:

    JUMPER

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

RMCF2512ZT0R00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF2512ZT0R00 is a rectangular pad with a size of 1.3mm x 2.5mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a heat sink or thermal interface material if the application requires high power dissipation.
  • The maximum operating temperature range for the RMCF2512ZT0R00 is -55°C to 150°C, but the recommended operating temperature range is -40°C to 125°C for optimal performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Avoid overheating or applying excessive force, which can damage the component.
  • The recommended storage condition for the RMCF2512ZT0R00 is in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%.

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RMCF2512ZT0R00 Overview

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RMCF2512ZT0R00 Alternates

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Image Part Number Model
Part Image CR-12JC4----0R Viking Tech Corp

Metal Glaze/thick Film, 1W, 0ohm, Surface Mount, 2512
Part Image RMEF2512ZT0R00 SEI Stackpole Electronics Inc

Metal Glaze/thick Film, 1W, 0ohm, Surface Mount, 2512, CHIP
Part Image RC2512JK-070R YAGEO Corporation

Metal Glaze/thick Film, 1W, 0ohm, Surface Mount, 2512
Part Image CRCW2512000ZR67 Vishay Intertechnologies

Metal Glaze/thick Film, 1W, 0ohm, Surface Mount, 2512
Part Image CQ121W0000TDE Royal Electronic Factory (Thailand) Co Ltd

Metal Glaze/thick Film, 1W, 0ohm, Surface Mount, 2512
For a full list of alternate parts for RMCF2512ZT0R00, check out Findchips.com