RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, RECOM recommends following the derating curves provided in the datasheet. Additionally, the module should be mounted on a heat sink or a metal plate to dissipate heat, and the ambient temperature should be kept below 80°C.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF and a voltage rating of 50-100 V. The capacitor should be placed as close as possible to the input pins of the module to minimize noise and ripple.
Yes, the RN-1215S can be used in a redundant configuration to achieve high reliability. RECOM recommends using a redundant configuration with diode ORing or active ORing to ensure that the output voltage remains stable even in the event of a module failure.
The maximum allowed input voltage ripple for the RN-1215S is 10% of the nominal input voltage. Exceeding this limit may affect the module's reliability and performance.
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