RN1302,LF footprint, schematic symbol and 3D model by Toshiba

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Part Number RN1302,LF
Manufacturer Toshiba
Pin Count 3
Part Category Transistor
Package Category SOT23 (3-Pin)
Footprint Name SOT23 (3-Pin) - 2-2E1A-1
Released Date Oct 22, 2017
Last Modified Date Apr 4, 2025 2:48 PM UTC
Pinout / Pin List Click Here (Member Only)

RN1302,LF Details

Manufacturer Part Number:
RN1302,LF
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
ECCN Code:
EAR99
Factory Lead Time:
12 Weeks
Manufacturer:
Toshiba America Electronic Components
YTEOL:
6
Additional Feature:
BUILT IN BIAS RESISTANCE RATIO IS 1
Collector Current-Max (IC):
0.1 A
Collector-Base Capacitance-Max:
6 pF
Collector-Emitter Voltage-Max:
50 V
Configuration:
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE):
50
JESD-30 Code:
R-PDSO-G3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation Ambient-Max:
0.1 W
Power Dissipation-Max (Abs):
0.1 W
Surface Mount:
YES
Terminal Form:
GULL WING
Terminal Position:
DUAL
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
250 MHz
VCEsat-Max:
0.3 V

RN1302,LF Frequently Asked Questions (FAQs)

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. Operating the device above this voltage may cause permanent damage.
Yes, the RN1302,LF is suitable for high-frequency switching applications up to 1MHz. However, ensure that the device is properly bypassed and decoupled to minimize electromagnetic interference (EMI).
Use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and ensure proper grounding and decoupling of the device. Follow good PCB layout practices to minimize radiation and conduction of EMI.

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