RN2426(TE85L,F) - Toshiba

RN2426(TE85L,F) Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
• How do I ensure reliable operation in high-temperature environments?
  To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design guidelines, such as providing adequate heat sinking, using a thermal interface material, and keeping the device within its recommended operating temperature range (−40°C to 125°C).
• What is the maximum allowed voltage on the input pins?
  Although the datasheet specifies a maximum input voltage of 5.5V, it's recommended to limit the input voltage to 5V to ensure reliable operation and prevent damage to the device.
• How do I handle ESD protection for this device?
  Toshiba recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input pins to protect the RN2426 from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
• What is the recommended soldering temperature and time for this device?
  Toshiba recommends a soldering temperature of 260°C (peak temperature) and a soldering time of 10 seconds or less to prevent damage to the device. It's also essential to follow the recommended soldering profile and use a solder with a melting point above 217°C.