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RN5RL33AA-TR-FE - Nisshinbo

Description: Low supply Current LDO Regulator

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PCB Footprints
RN5RL33AA-TR-FE - Nisshinbo PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SOT-23-5_2024-1
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3D Models
RN5RL33AA-TR-FE - Nisshinbo  - 3D model - SOT23 (5-Pin) - SOT-23-5_2024-1
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RN5RL33AA-TR-FE Details

  • Manufacturer Part Number:

    RN5RL33AA-TR-FE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 5 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nisshinbo Micro Devices

  • YTEOL:

    9

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.053 V

  • Dropout Voltage1-Nom:

    0.035 V

  • Input Voltage Absolute-Max:

    12 V

  • Input Voltage-Max:

    10 V

  • Input Voltage-Min:

    3.8 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e6

  • Length:

    4.5 mm

  • Line Regulation-Max:

    0.04092%

  • Load Regulation-Max:

    0.06%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.05 A

  • Output Voltage1-Max:

    3.382 V

  • Output Voltage1-Min:

    3.218 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2.484848%

  • Width:

    2.5 mm

RN5RL33AA-TR-FE Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Implement proper thermal management by providing adequate heat sinking and airflow. Ensure the device is operated within the specified temperature range (–40°C to 125°C) and consider using thermal interface materials if necessary.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds to 60 seconds. Avoid using wave soldering or hand soldering, as it may damage the device.
  • Yes, but ensure the device is properly secured to the PCB using a suitable adhesive or mechanical fastening method. Also, consider using a vibration-resistant mounting method, such as a screw-down or clip-in design.
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly configured and that the output voltage is within the specified range. Use an oscilloscope to measure the output voltage and check for any noise or oscillations.

Trust Checks

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RN5RL33AA-TR-FE Overview

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