ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure stable operation, ROHM recommends following the recommended operating conditions, including voltage, current, and temperature. Additionally, a thorough thermal design and layout are crucial to prevent overheating, which can affect the device's performance and reliability.
ROHM recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a lead-free solder alloy, and the soldering process should be done in a nitrogen atmosphere to prevent oxidation.
ROHM recommends storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. During shipping, the devices should be protected from mechanical stress, such as bending or flexing, and should not be exposed to electrostatic discharge (ESD).
The RN779DT146 is manufactured according to ROHM's quality and reliability standards, which include rigorous testing and inspection procedures. The device is compliant with industry standards such as AEC-Q101 and IEC 60747-1, ensuring high reliability and quality for automotive and industrial applications.
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