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RNCF0402BTE1K09 - Stackpole Electronics, Inc.

Description: RES PREC, 1.09 Kohm, 0402, 0.1%, 25 ppm

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RNCF0402BTE1K09 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RNCF0402BTE1K09 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RNCF0402
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RNCF0402BTE1K09 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RNCF0402
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RNCF0402BTE1K09 Details

  • Manufacturer Part Number:

    RNCF0402BTE1K09

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    15

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1090 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    50 V

RNCF0402BTE1K09 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RNCF0402BTE1K09 is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While the RNCF0402BTE1K09 is rated for operation up to 150°C, it's not recommended for continuous operation above 125°C. Prolonged exposure to high temperatures can affect the resistor's stability and reliability.
  • Handle the RNCF0402BTE1K09 by the edges to prevent damage to the resistor body or terminations. Avoid touching the component with bare hands, as the oils from skin can affect solderability. Use anti-static wrist straps and mats to prevent electrostatic discharge (ESD) damage.
  • The RNCF0402BTE1K09 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, ensure that the PCB is properly coated with a moisture-resistant material, and follow proper storage and handling procedures.
  • The recommended soldering profile for RNCF0402BTE1K09 is a peak temperature of 260°C, with a dwell time of 3-5 seconds. Ensure that the soldering iron is set to a temperature of 350-370°C, and use a solder with a melting point of 217-220°C.

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RNCF0402BTE1K09 Overview

Use the download button to access the RNCF0402BTE1K09 schematic symbol, PCB footprint, and 3D model.
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