RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the RNM-3.33.3S/P is designed to withstand high vibrations. However, it's recommended to follow the recommended PCB layout and mounting guidelines to ensure the module is securely attached to the PCB. Additionally, the module's pins should be soldered securely to prevent damage from vibration.
The maximum capacitance on the output depends on the specific application and the desired output voltage ripple. As a general guideline, RECOM recommends a maximum capacitance of 10uF to 22uF for most applications. However, it's recommended to consult with RECOM's application engineers for specific guidance on output capacitance selection.
The RNM-3.33.3S/P is rated for operation up to 80°C ambient temperature. However, the module's derating curve should be consulted to ensure the module can operate within the desired temperature range. Additionally, the module's thermal performance should be evaluated to ensure it can operate within the desired temperature range.
RECOM recommends using a low-ESR input capacitor with a value of 10uF to 22uF. The capacitor type should be a ceramic or film capacitor with a voltage rating of at least 50V. The input capacitor should be placed as close as possible to the module's input pins to minimize noise and ripple.
Trust Checks
This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
RNM-3.33.3S/P Overview
Use the download button to access the RNM-3.33.3S/P schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RNM-3,
or try a keyword search, such as Power Supply Modules
