RECOM Power Inc recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 1 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the ROL-1205S/P is designed to withstand high-vibration environments. However, it's essential to ensure that the module is properly secured to the PCB and that the PCB is rigid enough to withstand the vibrations. Additionally, the module's thermal interface material should be suitable for high-vibration applications.
To ensure the reliability of the ROL-1205S/P in a humid environment, it's recommended to apply a conformal coating to the module and the PCB. Additionally, the module should be stored in a dry environment before installation, and the PCB should be designed with humidity protection in mind.
The ROL-1205S/P can tolerate a maximum input voltage deviation of ±10% of the nominal input voltage. Exceeding this deviation may affect the module's performance and reliability.
Yes, the ROL-1205S/P can be used in a parallel configuration to increase the output power. However, it's essential to ensure that the modules are identical and that the output voltages are matched to within 1% to prevent uneven current sharing.
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ROL-1205S/P Overview
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