RECOM Power recommends a PCB layout with a large copper area for heat dissipation, and a thermal via under the module to improve heat transfer. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) can be used to improve heat transfer between the module and the heat sink.
RECOM Power recommends following the recommended soldering profile, using a solder with a melting point below 260°C, and avoiding excessive soldering temperatures or times. The module should be handled by the edges to avoid damage to the components. A reflow oven with a controlled temperature profile is recommended.
RECOM Power recommends using a low-ESR ceramic capacitor with a value of 10-22uF, X7R or X5R dielectric, and a voltage rating of 25V or higher. The capacitor should be placed as close as possible to the input pins of the module.
RECOM Power recommends using external overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the module. The OVP circuit should be set to trigger at 12-15% above the maximum input voltage, and the OCP circuit should be set to trigger at 1.5-2 times the maximum output current.
The typical efficiency of the RP08-243.3SAW/SMD module is around 85-90% at full load, and the power loss is around 2-3W at full load. However, these values may vary depending on the input voltage, output current, and operating temperature.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
RP08-243.3SAW/SMD Overview
Use the download button to access the RP08-243.3SAW/SMD 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like RP08-,
or try a keyword search, such as Power Supply Modules
