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RP150K008B-TR - Nisshinbo

Description: Dual 300mA Voltage Regulator (LDO Regulator)

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RP150K008B-TR Details

  • Manufacturer Part Number:

    RP150K008B-TR

  • Part Life Cycle Code:

    Active

  • Package Description:

    2 X 2 MM, PLP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nisshinbo Micro Devices

  • YTEOL:

    6.4

  • Dropout Voltage1-Max:

    0.8 V

  • Dropout Voltage2-Max:

    0.34 V

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    2.5 V

  • JESD-30 Code:

    S-XDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Number of Functions:

    1

  • Number of Outputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Output Current1-Max:

    0.3 A

  • Output Current2-Max:

    0.3 A

  • Output Voltage1-Max:

    2 V

  • Output Voltage1-Min:

    1.6 V

  • Output Voltage1-Nom:

    1.8 V

  • Output Voltage2-Max:

    2.828 V

  • Output Voltage2-Min:

    2.772 V

  • Output Voltage2-Nom:

    2.8 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE MULTIPLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.6 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

RP150K008B-TR Frequently Asked Questions (FAQs)

  • The recommended PCB land pattern can be found in the Nisshinbo Micro Devices' application note AN-XXXX, which provides detailed guidelines for layout and assembly.
  • The device has a thermal pad on the bottom, which should be connected to a thermal pad on the PCB. Ensure good thermal conductivity between the device and the PCB to prevent overheating.
  • The recommended soldering profile is a peak temperature of 260°C for 10-30 seconds, with a ramp-up rate of 2-3°C/s and a ramp-down rate of 2-3°C/s. Refer to the JEDEC standard J-STD-020 for more information.
  • The device is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you need to operate in such conditions, consider using a device with a higher moisture sensitivity level (MSL) rating.
  • The absolute maximum rating for the device is 150V. However, it's recommended to operate within the specified voltage range of 1.8V to 5.5V to ensure optimal performance and reliability.

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RP150K008B-TR Overview

Use the download button to access the RP150K008B-TR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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