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RP73PF1E40K2BTDF - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Width .5 MM | Product Length 1 MM | Product Length .039 INCH | Product Width .02 INCH | Product Height .012 INCH | Product Height .3 MM | Electrical Characteristics: Passive Component Tolerance .1 PCT | Power Rating .1 WATT | Operating Voltage 25 V | Resistance Class 1kΩ – 1MΩ | Resistance Value 40.2K OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Package Size Code 0402 | Element Type Thin Film | Resi

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RP73PF1E40K2BTDF - TE Connectivity - PCB symbol
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RP73PF1E40K2BTDF - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - RP 731E (0402=)
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RP73PF1E40K2BTDF - TE Connectivity - 3D model - Resistor Chip - RP 731E (0402=)
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RP73PF1E40K2BTDF Details

  • Manufacturer Part Number:

    RP73PF1E40K2BTDF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    3

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.3 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR

  • Physical Dimension:

    1mm x .5mm x .3mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    40200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    50 V

RP73PF1E40K2BTDF Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure proper soldering and to prevent thermal issues.
  • Proper thermal management is crucial for the reliability and performance of RP73PF1E40K2BTDF. Ensure good airflow, use thermal vias, and consider heat sinks or thermal pads to dissipate heat. Consult TE Connectivity's thermal management guidelines for more information.
  • While the datasheet specifies the operating temperature range, it's essential to note that the maximum operating temperature range may vary depending on the specific application and environmental conditions. Consult with TE Connectivity's technical support or application notes for more information.
  • RP73PF1E40K2BTDF is designed to meet certain vibration and shock standards, but it's crucial to evaluate the specific requirements of your application. Consult TE Connectivity's technical support or application notes to determine the suitability of RP73PF1E40K2BTDF for your specific use case.
  • Follow TE Connectivity's recommended storage and handling guidelines, and ensure that your production process meets their quality and reliability standards. This may include controlling the soldering process, using proper cleaning and drying procedures, and implementing quality control checks.

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RP73PF1E40K2BTDF Overview

Use the download button to access the RP73PF1E40K2BTDF schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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