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RQ3E120ATTB - ROHM Semiconductor

Description: P-Channel MOSFET, 39 A, 30 V, 8-Pin HSMT ROHM RQ3E120ATTB

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PCB Footprints
RQ3E120ATTB - ROHM Semiconductor PCB footprint - Other - Other - HSMT8(3.3 x 3.3)
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3D Models
RQ3E120ATTB - ROHM Semiconductor  - 3D model - Other - HSMT8(3.3 x 3.3)
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RQ3E120ATTB Details

  • Manufacturer Part Number:

    RQ3E120ATTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan, Mainland China, Thailand

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.0113 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    48 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RQ3E120ATTB Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings, and use a stable voltage source. Also, ensure that the input and output capacitors are properly selected and placed close to the device.
  • When handling the device, take precautions to prevent electrostatic discharge (ESD) damage by using an ESD wrist strap or mat, and avoid touching the pins or leads. Also, avoid bending or flexing the leads, and handle the device by the body, not the leads.
  • To troubleshoot issues with the device, start by checking the PCB layout and thermal design, and ensure that the device is properly biased and cooled. Use a thermal camera or thermometer to check for hotspots, and use a multimeter to check for voltage and current anomalies.
  • Yes, the input and output capacitors should be selected based on the device's operating frequency and voltage ratings. A minimum capacitance of 10uF is recommended for the input capacitor, and a minimum capacitance of 22uF is recommended for the output capacitor.

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RQ3E120ATTB Overview

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