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RQ3G110ATTB - ROHM Semiconductor

Description: ROHM - RQ3G110ATTB - Power MOSFET, P Channel, 40 V, 35 A, 0.0098 ohm, RDS 12.4mΩ, PD 20W, HSMT8, Surface Mount

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RQ3G110ATTB - ROHM Semiconductor PCB footprint - Other - Other - RQ3G110ATTB-1
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RQ3G110ATTB - ROHM Semiconductor  - 3D model - Other - RQ3G110ATTB-1
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RQ3G110ATTB Details

  • Manufacturer Part Number:

    RQ3G110ATTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2020-10-16

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    9.5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.0157 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    250 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    20 W

  • Pulsed Drain Current-Max (IDM):

    44 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RQ3G110ATTB Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Use a bypass capacitor (e.g., 1uF) between the VIN and GND pins to filter out noise and ensure stable operation. Additionally, ensure that the input voltage is within the recommended range.
  • The maximum allowable voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • While the RQ3G110ATTB can handle high currents, it's essential to consider the thermal limitations. Ensure that the device is properly heatsinked, and the PCB is designed to handle the current requirements.
  • Implement overcurrent protection using an external circuit, such as a fuse or a current-sensing resistor, to prevent damage to the device in case of an overcurrent event.

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RQ3G110ATTB Overview

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