Part Image

RQ3L070ATTB - ROHM Semiconductor

Description: P-Channel 60 V 25A (Tc) 2W (Ta) Surface Mount 8-HSMT (3.2x3)

Download RQ3L070ATTB Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
RQ3L070ATTB - ROHM Semiconductor PCB footprint - Other - Other - RQ3L070ATTB-3
click to zoom
3D Models
RQ3L070ATTB - ROHM Semiconductor  - 3D model - Other - RQ3L070ATTB-3
click to zoom

RQ3L070ATTB Details

  • Manufacturer Part Number:

    RQ3L070ATTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Date Of Intro:

    2020-10-16

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    5.5 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    7 A

  • Drain-source On Resistance-Max:

    0.032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    170 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    20 W

  • Pulsed Drain Current-Max (IDM):

    28 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RQ3L070ATTB Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
  • Use a stable input voltage, ensure proper PCB layout, and consider using a thermal management solution such as a heat sink or thermal interface material.
  • The maximum power dissipation is dependent on the ambient temperature and PCB layout. A general guideline is to limit the power dissipation to 2.5W or less.
  • Yes, the RQ3L070ATTB is AEC-Q100 qualified and suitable for high-reliability and automotive applications, but additional testing and validation may be required.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines, and follow proper handling and storage procedures to prevent ESD damage.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

RQ3L070ATTB Overview

Use the download button to access the RQ3L070ATTB schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RQ3L0, or try a keyword search, such as Power Field-Effect Transistors

Parts related to RQ3L070ATTB

Showing 0 results